LED-MODULES-Manufacturing process

To acquire the same brightness, color, voltage and keep every single parameter strictly under the requirement of customers, production in each processing need to be entirely adapted and exactly traceable.

In-house production covers R&D development, purchasing & incoming materials full inspection, prototype-making, pre-production, SMT assembly, and warehousing, forming a completed processing chain to create each flawless LED MODULE on the scene.

Compliance with reliable quality and safety guidelines should be the top priority for LED modules’ manufacturing.

There are major process flows for LED modules’ production line:

Solder paste printing, a critical process involved with soldering points.

Typical defective soldering points of LED modules can be recognized in the paste printing, only lead-free solder can be used strictly as Environmental standards.

Basically, the quality of solder paste printing determines the quality of whole SMT processing.

We verify with high precision of soldering to control each point is traceable and less prone to errors.

  • Dynamically speaking, the lower the viscosity is, the better the liquidity, that the solder paste is more easier to flow into the printing hole and onto the solder pad.
  • Statically speaking, the higher the viscosity is, the more likely that the solder paste will remain in its filled shape through the stencil opening onto the PCB and not collapse
  • During the process of solder paste printing, the printed circuit board is placed on the worktable and mechanically or vacuum clamped, well positioning with a locating pin/visual alignment.

LED Mounting & Device Placement.

LED Mounting and components placement is the heart of LED Module SMT production, YAMAHA machines offer the most modern assembly technology and process over 35,000 CPH. to achieve high-speed, high-precision, automatic placement components, mostly decide the efficiency and accuracy of the completed processing, so the placement machine is the most critical and most complex equipment, accounting for more than 70% of the investments in the entire SMT production line.

Features and functions of fully automatic tracking, sector, and mounting system, includes

  • Full traceability of all production data
  • Vacuum pressure sensor/photoelectric sensor detects whether the element absorbed.
  • Visioning system detects element horizontally and identify characteristics of components
  • Read the pre-set database, measure and compare values
  • Calculate the angle of center&angle position
  • Adjust element’s angle and implement assembly

SMT workflow: Plate and Mark identification, automatic learning, suction nozzle selection, feeder selection, component pick-up, component testing to evaluate, placement, suction nozzle return, out of the plate.

Reflow Air Soldering System

Reflow soldering is the core technology of SMT process. All electronic components on PCB are welded once by whole heating, the quality control of SMT production line in electronic factory is to obtain excellent welding quality in the end.

The reflow temperature curve of the Surface-Mount Technology (SMT, Surface Mount Technology) consists of

  • Preheating
  • Heat Preservation
  • Rewelding
  • Cooling

Independently adjustable process zones enable variable reflow profiling, equiped with software oven management system enable touching operation to well monitor, control and analyze PCB reflow temperature curve.

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